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- Details
- Description
- Published by:
- Sia White
- Published:
- 10/14/2014
- Specs:
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Flyer / 8.25" x 10.75"2 pages
- Category:
- Business & Finance
- Tags:
Wafer Level Chip Scale Package is fast becoming popular because of its small form factor utilized in such applications as Wifi, Bluetooth and GPS units. The WLCSP is also very cost-effective with a simplified manufacturing process that eliminates the need for the final or package test step.
Other Publications by Sia White
1 other publication
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Flyer / 8.25" x 10.75"
Print: $0.52 +
Digital: $2.00